ECK33-BCE2E16-I Carte mère Allwinner T536 16 Go ROM Processeur IA multicœur hétérogène ARM+RISC-V haute fiabilité Prise en charge des bus locaux et parallèles Interconnexion FPGA
[Modèle de processeur]：T536
[Fréquence]： 1,6 GHz
[Mémoire]：2 GB
[Stockage]：16 GB
[Dimensions]：45 x 43 x 3,5 mm
[Poids du produit]：15,8 ± 2 g
[Introduction]：Ebyte's ECK33-B series core boards are carefully designed based on Allwinner's T536 series processors. Featuring a new LGA interface, they offer high performance, low power consumption, high reliability, and are manufactured domestically. They are widely used in content sharing and self-service terminals, smart manufacturing, and other electronic commerce and industrial equipment.
Magasin officiel| Informatique Industrielle | Modèle de processeur | Fréquence du processeurHz | Capacité mémoireMB | Capacité de stockageMB | Tension de fonctionnementV | Formulaire d'interface | Taille du produitmm | Température de fonctionnement℃ | Caractéristiques | Manual | Muestra |
|---|---|---|---|---|---|---|---|---|---|---|---|
| ECK31-T13SA2ME8G | T113-S4 | 1.2G | 256 | 8GB | 5 | Stamp Hole | 35*29*3.0 | -25 - 85 | Made-in China, T113-S Core Board ,Supports Linux, Supports QT | ||
| ECK31-T13SA2MN2M | T113-S4 | 1.2G | 256 | 256 | 5 | stamp hole | 35*29*3.0 | -25-85 | Made-in China, T113-S Core Board ,Supports Linux, Supports QT | ||
| ECK31-T13SA1ME8G | T113-S3 | 1.2G | 128 | 8GB | 5 | Stamp Hole | 35*29*3.0 | -25 - 85 | Made-in China, T113-S Core Board ,Supports Linux, Supports QT | ||
| ECK31-T13SA1MN2M | T113-S3 | 1.2G | 128 | 256 | 5 | Stamp Perforation | 35*29*3.0 | -25 - 85 | Made-in China, T113-S Core Board ,Supports Linux, Supports QT | ||
| ECK33-BCE2E16-I | T536MX-CEX | 1.6G | 2GB | 16GB | 5 | LGA | 45*43*3.5 | -40~+85 | High-performance quad-core A55 processor, multi-core heterogeneous ARM+RISC-V architecture | ||
| ECK33-B2N4E32-I | T536MX-CEN2 | 1.6G | 4GB | 32GB | 5 | LGA | 45*43*3.5 | -40~+85 | High-performance quad-core A55, 2TOPS AI NPU, multi-core heterogeneous ARM+RISC-V | ||
| ECK30-T13IC1E8-I | T113-i | 1,2 G | 1 GB | 8 GB | 5 | BTB | 46*36*5,3 | -40~85 | Architecture hétérogène multicœur de qualité industrielle | ||
| ECK30-T13IC5E8-I | T113-i | 1,2 G | 512 | 8 G | 5 | BTB | 46*36*5,3 | -40~85 | Architecture hétérogène multicœur hautes performances de qualité industrielle | ||
| ECK30-T13IC2N2-I | T113-i | 1,2 G | 256 | 256 | 5 | BTB | 46*36*5,3 | -40~85 | Qualité industrielle, fabrication nationale, hautes performances, multicœur hétérogène | ||
| ECK32-T527B4E32-N | T527M/MN | 1.8G | 4GB | 32GB | 5 | LGA | 45*43*3.5 | -25~85 | High-performance octa-core A55, integrated GPU, multi-core heterogeneous ARM+RISC-V | ||
| ECK32-T527B2E16-I | T527M/MN | 1.8G | 2GB | 16GB | 5 | LGA | 45*43*3.5 | -40~85 | High-performance octa-core A55 processor, integrated GPU | ||
| ECK32-T527BN4E32-N | T527M/MN | 1.8G | 4GB | 32GB | 5 | LGA | 45*43*3.5 | -25~85 | High-performance octa-core A55, 2TOPS AI NPU, integrated GPU | ||
| ECK32-T527BN4E32-I | T527M/MN | 1.8G | 4GB | 32GB | 5 | LGA | 45*43*3.5 | -40~85 | High-performance octa-core A55, 2TOPS AI NPU, integrated GPU,industrial-grade, Linux support | ||
| ECK30-T13IA1GE8G-I | T113-i | 1.2G | 1GB | 8GB | 5 | trou de tampon | 45*35*3.6 | -40-85 | double cœur ARM + RISC-V, affichage haute définition, haute fiabilité | ||
| ECK30-T13IA5ME8G-I | T113-j | 1,2 | 1 GB | 8 GB | 5 | trou de tampon | 45*35*3.6 | -40-85 | Qualité industrielle, double cœur ARM + RISC-V, affichage haute définition | ||
| ECK30-T13IA2MN2M-I | T113-je | 1,2 G | 256 MB | 256 MB | 5V | trou de tampon | 45×35×3,6 | -40-85 | qualité industrielle, double cœur ARM + RISC-V, affichage haute définition |