RK3562J/RK3562, 22nm;

Quad-core ARM Cortex-A53(64bit), up to 2.0GHz;

ARM Cortex-M0 MCU, up to 200MHz;

NPU, up to 1 TOPS (RK3562J not support);

GPU, Mali-G52-2EE;

On board 2GB LPDDR4;

On board 32GB eMMC;

H.265 decoder up to 4K@30fps;

H.264 decoder up to 1080P@60fps;

JPEG decoder up to 65536x65536;

H.264 encoder up to 1080P@60fps;

JPEG encoder up to 8192x8192;

1x RGB Parallel interface, up to 2048x1080@60fps;

1x LVDS interface, up to 800x1280@60fps;

1x 4-lane MIPI DSI interface, up to 2048x1080@60fps;

2x 4-lane or 4x 2-lane MIPI CSI V1.2, up to 2.5Gbps per lane;

3x SAI, support I2S, PCM, TDM, sample rate up to 192KHz;

1x SPDIF;

1x PDM, up to 8 channels, sample rate up to 192KHz;

1x single end or differential mode Micro-phone input (RK809);

1x class-AB PA to drive Head-phone output (RK809);

1x class-D PA to drive speaker output (RK809);

2x SDMMC;

1x MAC, 10/100 Mbps port with RMII interfaces;

1x GMAC, 10/100/1000 Mbps port with RGMII and RMII interfaces;

1x USB 2.0 HOST;

1x USB 2.0 OTG;

1x USB 3.0 HOST/PCIe 2.1, one lane, RC mode only;

3x SPI Controller, two chip-select per SPI;

6x I2C Master, standard mode 100Kbit/s and fast mode 400Kbit/s;

10x UART, up to 4Mbps baud rate;

16x on-chip PWM, embedded 32bits timer/counter;

2x CAN controllers, support CAN 2.0B protocol;

16x single-ended input, 10bits resolution, up to 1MS/s;

86x GPIO, Supports Interrupt input;

DC +5V@1A;

DC +3.3V@500mA(VCC_3V3);

DC +3.3V@100mA(VCCIO_ACODEC);

Operating Temperature: -25 to +85 °C / -40 to +85 °C;

45mm x 35mm;

140-PIN stamp hole + 66-PIN LGA

10-layer board design;