E22-170M33S_SX1262_LoRa_Module

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E22-170M33S Module émetteur-récepteur RF SX1262 Technologie LoRa à spectre étalé Portée 16 km plus longue Format compact Faible consommation d'énergie

[Solution de puce]：SX1262

[Fréquence]：150,125-170,125 MHz

[Puissance d’émission]：33 dBm

[Portée de communication]：16 km

[Dimensions]：24 x 38,5 mm

[Poids]：5,1 ± 0,2 g

[Introduction]：Le module E22-170M33S est un module sans fil LoRa ultra-compact, 170,125 MHz, monté en surface, développé indépendamment et basé sur la puce RF LoRa™ de nouvelle génération de Semtech, le SX1262. Utilisant le SX1262 importé comme cœur, ce module offre des performances anti-interférences et une portée de communication améliorées par rapport aux émetteurs-récepteurs LoRa™ de génération précédente. Grâce à la dernière technologie de modulation LoRa™, ses performances anti-interférences et sa portée de communication dépassent largement celles des méthodes de modulation FSK et GFSK existantes. Ce module LoRa est principalement destiné aux applications de domotique, de relevé de compteurs sans fil, à la recherche scientifique et aux applications médicales, ainsi qu'aux équipements de communication sans fil à moyenne et longue portée.

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Pin number	Pin Name	Pin direction	Pin Purpose
1	GND	-	Ground wire, connected to the power reference ground
2	GND	-	Ground wire, connected to the power reference ground
3	GND	-	Ground wire, connected to the power reference ground
4	GND	-	Ground wire, connected to the power reference ground
5	GND	-	Ground wire, connected to the power reference ground
6	RXEN	input	The RF switch receives the control pin and connects to the external MCU IO. Please refer to Table 1 below for logic control and the control routines on the EBYTE official website DEMO.
7	TXEN	input	The RF switch transmit control pin is connected to an external MCU IO or DIO2 (see the SX1262 manual for details). For logic control, please refer to Table 1 below. For control routines, please refer to the EBYTE official website DEMO.
8	DIO2	Input/Output	Configurable general IO port (see SX1262 manual for details)①
9	VCC	-	Power supply, range 2.5～5.5V (it is recommended to add external ceramic filter capacitor)
10	VCC	-	Power supply, range 2.5～5.5V (it is recommended to add external ceramic filter capacitor)
11	GND	-	Ground wire, connected to the power reference ground
12	GND	-	Ground wire, connected to the power reference ground
13	DIO1	Input/Output	Configurable general IO port (see SX1262 manual for details)
14	BUSY	Output	Used for status indication (see SX1262 manual for details)
15	NRST	input	Chip reset trigger input pin, low level is valid
16	MISO	Output	SPI data output pin
17	MONEY	input	SPI data input pin
18	SCK	input	SPI clock input pin
19	NSS	input	Module chip select pin, used to start an SPI communication
20	GND	-	Ground wire, connected to the power reference ground
21	ON	-	Antenna interface, stamp hole (50Ω characteristic impedance). Because the module has a built-in PA, there is an amplification relationship between the output power of the SX1262 RF chip (pre-stage) and the actual output power of the module. Please refer to Table 2 below.
22	GND	-	Ground wire, connected to the power reference ground
-	DIO3	Input/Output	Used internally in the module to power the 32MHZ TCXO crystal oscillator (DIO3 is configured to output 2.2V)

Note ①: If the DIO and TXEN pins are short-circuited, the DIO2 switch control function needs to be enabled in the software.

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