| Informatique Industrielle | Modèle de processeur | Fréquence du processeurHz | Capacité mémoireMB | Capacité de stockageMB | Tension de fonctionnementV | Formulaire d'interface | Taille du produitmm | Température de fonctionnement℃ | Caractéristiques | Manual | Muestra |
|---|---|---|---|---|---|---|---|---|---|---|---|
| ECK31-T13SA2ME8G | T113-S4 | 1.2G | 256 | 8GB | 5 | Stamp Hole | 35*29*3.0 | -25 - 85 | Made-in China, T113-S Core Board ,Supports Linux, Supports QT | ||
| ECK31-T13SA2MN2M | T113-S4 | 1.2G | 256 | 256 | 5 | stamp hole | 35*29*3.0 | -25-85 | Made-in China, T113-S Core Board ,Supports Linux, Supports QT | ||
| ECK31-T13SA1ME8G | T113-S3 | 1.2G | 128 | 8GB | 5 | Stamp Hole | 35*29*3.0 | -25 - 85 | Made-in China, T113-S Core Board ,Supports Linux, Supports QT | ||
| ECK31-T13SA1MN2M | T113-S3 | 1.2G | 128 | 256 | 5 | Stamp Perforation | 35*29*3.0 | -25 - 85 | Made-in China, T113-S Core Board ,Supports Linux, Supports QT | ||
| ECK33-BCE2E16-I | T536MX-CEX | 1.6G | 2GB | 16GB | 5 | LGA | 45*43*3.5 | -40~+85 | High-performance quad-core A55 processor, multi-core heterogeneous ARM+RISC-V architecture | ||
| ECK33-B2N4E32-I | T536MX-CEN2 | 1.6G | 4GB | 32GB | 5 | LGA | 45*43*3.5 | -40~+85 | High-performance quad-core A55, 2TOPS AI NPU, multi-core heterogeneous ARM+RISC-V | ||
| ECK30-T13IC1E8-I | T113-i | 1,2 G | 1 GB | 8 GB | 5 | BTB | 46*36*5,3 | -40~85 | Architecture hétérogène multicœur de qualité industrielle | ||
| ECK30-T13IC5E8-I | T113-i | 1,2 G | 512 | 8 G | 5 | BTB | 46*36*5,3 | -40~85 | Architecture hétérogène multicœur hautes performances de qualité industrielle | ||
| ECK30-T13IC2N2-I | T113-i | 1,2 G | 256 | 256 | 5 | BTB | 46*36*5,3 | -40~85 | Qualité industrielle, fabrication nationale, hautes performances, multicœur hétérogène | ||
| ECK32-T527B4E32-N | T527M/MN | 1.8G | 4GB | 32GB | 5 | LGA | 45*43*3.5 | -25~85 | High-performance octa-core A55, integrated GPU, multi-core heterogeneous ARM+RISC-V | ||
| ECK32-T527B2E16-I | T527M/MN | 1.8G | 2GB | 16GB | 5 | LGA | 45*43*3.5 | -40~85 | High-performance octa-core A55 processor, integrated GPU | ||
| ECK20-6Y28C5E8-I | MCIMX6Y2CVM08AB | 792M | 512 | 8G | 5 | BTB | 46*36*6.8 | -40~85 | Industrial-grade, low power consumption, high cost-effectiveness, high reliability, supports Linux and QT | ||
| ECK20-6Y28C5E8-C | MCIMX6Y2CVM08AB | 792M | 512 | 8G | 5 | BTB | 46*36*6.8 | 0~70 | Low power consumption, high cost-effectiveness, high reliability, supports Linux and QT | ||
| ECK10-135D5E8-C | STM32MP135DAF7 | 1G | 512 | 8GB | 5 | Gold fingers | 67.6*30*4.5 | 0⁓70 | High-reliability embedded core board, suitable for computing power control scenarios such as servers and gateways. The gold fingers are easily replaceable, and it features low power consumption. | ||
| ECK32-T527BN4E32-N | T527M/MN | 1.8G | 4GB | 32GB | 5 | LGA | 45*43*3.5 | -25~85 | High-performance octa-core A55, 2TOPS AI NPU, integrated GPU |